You have arrived on the Request for Quote (RFQ) page for part number 91L02DM-B, a Advanced Micro Devices Inc component that is listed with the product description “Microcircuit Memory” and NSN 5962-01-043-6195 for fast identification. By using the form supplied below, you can offer details regarding your requirements to secure customized procurement solutions for your consideration. As our goal is to provide quick service, you can expect a response within 15 minutes of our staff members reviewing your submission. Alternatively, if you use the email or phone number at the bottom of the webpage, you can directly connect with our experts to discuss your needs.
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Alongside Advanced Micro Devices Inc part number 91L02DM-B, you can seamlessly search for more items from this manufacturer or CAGECode 34335 using our curated catalogs. Similarly, we also offer means for locating other products that belong to FSC 5962 Microcircuits Electronic, which this component falls under having the NSN 5962-01-043-6195. Whether you desire part number 91L02DM-B or other NSN components, you can rest assured that our entire inventory is sourced from reputable manufacturers and suppliers. Bearing this in mind, kick off procurement today to see why so many customers select Aero Defence Solutions as their trusted purchasing hub.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-043-6195 Item Description: MICROCIRCUIT,MEMORY | 5962 | 010436195 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 91L02DM-B | 3 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | Memory Device Type | RAM |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 13 INPUT |
| ADAT | Body Width | 0.278 INCHES MINIMUM AND 0.298 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC AND GLASS |
| TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND LOW POWER AND W/STORAGE AND W/DECODED OUTPUT |
| ADAQ | Body Length | 0.770 INCHES MINIMUM AND 0.808 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 260.0 MILLIWATTS |
| ADAU | Body Height | 0.085 INCHES MINIMUM AND 0.124 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MRC | Decoded Requirement | Clear Text Reply |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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