You have arrived on the Request for Quote (RFQ) page for part number 310403P18, a Bae Systems Inc component that is listed with the product description “Microcircuit Memory” and NSN 5962-01-016-7272 for fast identification. By using the form supplied below, you can offer details regarding your requirements to secure customized procurement solutions for your consideration. As our goal is to provide quick service, you can expect a response within 15 minutes of our staff members reviewing your submission. Alternatively, if you use the email or phone number at the bottom of the webpage, you can directly connect with our experts to discuss your needs.
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Alongside Bae Systems Inc part number 310403P18, you can seamlessly search for more items from this manufacturer or CAGECode 94117 using our curated catalogs. Similarly, we also offer means for locating other products that belong to FSC 5962 Microcircuits Electronic, which this component falls under having the NSN 5962-01-016-7272. Whether you desire part number 310403P18 or other NSN components, you can rest assured that our entire inventory is sourced from reputable manufacturers and suppliers. Bearing this in mind, kick off procurement today to see why so many customers select Aero Defence Solutions as their trusted purchasing hub.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-016-7272 Item Description: Microcircuit Memory | 5962 | 010167272 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 310403p18 | C | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| MEMORY | ADAQ | BODY LENGTH0 365 INCHES MINIMUM AND 0 440 INCHES MAXIMUM |
| MEMORY | ADAT | BODY WIDTH0 265 INCHES MINIMUM AND 0 315 INCHES MAXIMUM |
| MEMORY | ADAU | BODY HEIGHT0 035 INCHES MINIMUM AND 0 070 INCHES MAXIMUM |
| MEMORY | AFGA | OPERATING TEMP RANGE-55 0125 0 DEG CELSIUS |
| MEMORY | AFJQ | STORAGE TEMP RANGE-65 0125 0 DEG CELSIUS |
| MEMORY | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED AND HIGH SPEED AND PROGRAMMABLE AND PROGRAMMED AND WBUFFERED OUTPUT AND WDECODED OUTPUT AND WENABLE AND 3-STATE OUTPUT AND POSITIVE OUTPUTS |
| MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC AND GLASS |
| MEMORY | CQSZ | INCLOSURE CONFIGURATIONFLAT PACK |
| MEMORY | CQWX | OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC |
| MEMORY | CQZP | INPUT CIRCUIT PATTERN10 INPUT |
| MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
| MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC-1 5 VOLTS MINIMUM POWER SOURCE AND 5 5 VOLTS MAXIMUM POWER SOURCE |
| MEMORY | CZEQ | TIME RATING PER CHACTERISTIC70 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT |
| MEMORY | CZER | MEMORY DEVICE TYPEROM |
| MEMORY | CZZZ | MEMORY CAPACITYUNKNOWN |
| MEMORY | TEST | TEST DATA DOCUMENT94117-310403 DRAWING THIS IS THE BASIC GOVERNING DRAWING SUCH AS A CONTRACTOR DRAWING ORIGINAL EQUIPMENT MANUFACTURER DRAWING ETC EXCLUDES ANY SPECIFICATION STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| MEMORY | TTQY | TERMINAL TYPE AND QUANTITY16 FLAT LEADS |
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