You have arrived on the Request for Quote (RFQ) page for part number 2104 S1234, a Intel Corporation component that is listed with the product description “Microcircuit Memory” and NSN 5962-01-094-9069 for fast identification. By using the form supplied below, you can offer details regarding your requirements to secure customized procurement solutions for your consideration. As our goal is to provide quick service, you can expect a response within 15 minutes of our staff members reviewing your submission. Alternatively, if you use the email or phone number at the bottom of the webpage, you can directly connect with our experts to discuss your needs.
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Alongside Intel Corporation part number 2104 S1234, you can seamlessly search for more items from this manufacturer or CAGECode 34649 using our curated catalogs. Similarly, we also offer means for locating other products that belong to FSC 5962 Microcircuits Electronic, which this component falls under having the NSN 5962-01-094-9069. Whether you desire part number 2104 S1234 or other NSN components, you can rest assured that our entire inventory is sourced from reputable manufacturers and suppliers. Bearing this in mind, kick off procurement today to see why so many customers select Aero Defence Solutions as their trusted purchasing hub.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-094-9069 Item Description: MICROCIRCUIT,MEMORY | 5962 | 010949069 | N | |||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 2104(S1234) | 3 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ | Storage Temp Range | -55.0/+150.0 DEG CELSIUS |
| CZER | Memory Device Type | ROM |
| CQZP | Input Circuit Pattern | 10 INPUT |
| ADAT | Body Width | 0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC |
| TEST | Test Data Document | 21101-49A0295 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| MRC | Decoded Requirement | Clear Text Reply |
| TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND DYNAMIC AND W/STROBE AND W/ENABLE |
| ADAQ | Body Length | 0.780 INCHES MINIMUM AND 0.820 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.25 WATTS |
| ADAU | Body Height | 0.185 INCHES MAXIMUM |
| AFGA | Operating Temp Range | +0.0/+70.0 DEG CELSIUS |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 25.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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