You have arrived on the Request for Quote (RFQ) page for part number IM6653MDG 883B, a Intersil Corporation component that is listed with the product description “Microcircuit Memory” and NSN 5962-01-160-2797 for fast identification. By using the form supplied below, you can offer details regarding your requirements to secure customized procurement solutions for your consideration. As our goal is to provide quick service, you can expect a response within 15 minutes of our staff members reviewing your submission. Alternatively, if you use the email or phone number at the bottom of the webpage, you can directly connect with our experts to discuss your needs.
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Alongside Intersil Corporation part number IM6653MDG 883B, you can seamlessly search for more items from this manufacturer or CAGECode 32293 using our curated catalogs. Similarly, we also offer means for locating other products that belong to FSC 5962 Microcircuits Electronic, which this component falls under having the NSN 5962-01-160-2797. Whether you desire part number IM6653MDG 883B or other NSN components, you can rest assured that our entire inventory is sourced from reputable manufacturers and suppliers. Bearing this in mind, kick off procurement today to see why so many customers select Aero Defence Solutions as their trusted purchasing hub.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-160-2797 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011602797 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| ROM/PROM FAMILY 044 | 2 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | GLCM BGM-109 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 11.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 600.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 600.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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